
Introduction
Fang Ji® FJ-AX series products are integrated non-destructive testing (NDT) and component counting equipment developed based on X-ray small focal spot and micro focal spot technology. Widely applicable for online or offline non-destructive testing of 3C electronic components, Printed Circuit Boards (PCB), Printed Circuit Board Assemblies (PCBA), Light-Emitting Diodes (LED), power battery cells and other products. The series is tailor-made for the non-destructive testing needs of industries such as Integrated Circuits (IC), Ball Grid Array (BGA), Flexible Printed Circuits (FPC), PCB, Surface Mount Technology (SMT), LED, 3D printing, and castings. Combining in-depth industry application characteristics with advanced industrial design concepts, the product features a sleek and aesthetically pleasing appearance, along with core advantages of easy installation and flexible mobility, adapting to diverse production scenarios.
Core features
1. Equipped with an exclusive component counting algorithm, featuring fast counting speed, wide compatibility with various material types (covering all kinds of electronic components), and minimal counting error, significantly improving material management efficiency;
2. Adopts a combination of VJ light source and IRay flat-panel detector, delivering high-definition imaging that accurately presents the internal structure and details of products, providing reliable visual support for defect detection;
3. The supporting software boasts powerful functions, supporting curvature measurement, precise dimension inspection, quantitative analysis of bubble area, BGA solder joint detection, short circuit/open circuit fault identification and other diversified testing needs, fully covering key quality control points in the production process;
4. For online CT testing of automotive power battery cells, the fastest testing speed is only 3 seconds per unit, with an average testing speed of 6-9 seconds per unit. The testing efficiency is at the leading level in the industry, meeting the batch testing requirements of high-speed production lines.
Technical Reference